TSK UF200 Spec Sheet

TSK UF200 Spec Sheet

Overall Accuracy Within 4µm
Wafer Size 5″, 6″, 8″
X/Y Axes
Probing Area
Maximum Speed
±120mm
200mm/s
Z axis
Full Stroke
Maximum Speed
69mm
35ms/0.5mm Stroke
0axis Rotation Range ±5 dec.
Fine Alignment CCD ITV Image Processing
Loader
Cassette Mounts
Wafter Handling
1 (2nd cassette with option)
Robot Arm / Backside Holding
Hard Disk 3.5″ 540MB (1 unit standard)
Floppy Disk 3.5″ 2HD/2DD (1 unit standard)
Display 10.4″ TFT Color LCD
Power Consumption Approximately 1.5kVA
Air Supply
Source Pressure
Consumption
0.4 MPa or more
Approximately 0.1 liters/wafer
Vacuum Supply Less than 50kPa, 30 liters/minute
Dimensions 1090W x 1100° x 880H mm
Weight 800kg (Standard)