APM90 G2 Spec Sheet
| Accuracy | within 5 Microns / 0.2 mil (± 2.5 microns) | |
| Wafer Size | 4,5, 6, and 8 inch | |
| Maximum X/Y Speed | 200 mm (8″) / sec. | |
| UF200 Processor |
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| Z Stage/Chuck | ||
| Range | 1.36″ | |
| Speed | 35 ms/0.020″ stroke | |
| Rotation | ± 5º | |
| Loader (wafer handler) | ||
| Cassette Capacity | 1 standard; 2nd cassette optional | |
| Wafer handling | robotic arm | |
| Fine Alignment | CCD image processing | |
| Hard Disk Drive | 100 MB | |
| Floppy Disk Drive | 3.5″; 1 standard | |
| Display | 10.4″ Color LCD | |
| Power Consumption | Approx 1.5 KVA | |
| Magnetic Optical Drive | 640MB | |
| Facilities Required | ||
| Air | 60 PSI @ 3 cfm. | |
| Vacuum | 25 in/hg. | |
| Dimensions | 44″w x 44″ D x 35.2″ H | |
| Weight | 1,650 lbs. |